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Ticker Symbol Entity Name As Of Date Company Name Followers Employees on Linkedin Link Industry Date Added Date Updated Description Website Specialities Logo HQ.Street HQ.City HQ.State HQ.Country HQ.Postal Ticker Sector Ticker Industry
nasdaq:amkr 7135 Apr 15th, 2019 12:00AM Amkor Technology, Inc. 24K 5605 Open Semiconductors Apr 14th, 2019 10:07PM Apr 14th, 2019 10:07PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Apr 14th, 2019 12:00AM Amkor Technology, Inc. 24K 5600 Open Semiconductors Apr 13th, 2019 10:06PM Apr 13th, 2019 10:06PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Apr 13th, 2019 12:00AM Amkor Technology, Inc. 24K 5600 Open Semiconductors Apr 12th, 2019 10:06PM Apr 12th, 2019 10:06PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Apr 12th, 2019 12:00AM Amkor Technology, Inc. 24K 5596 Open Semiconductors Apr 11th, 2019 10:07PM Apr 11th, 2019 10:07PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Apr 11th, 2019 12:00AM Amkor Technology, Inc. 23K 5596 Open Semiconductors Apr 11th, 2019 12:44PM Apr 11th, 2019 12:44PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Apr 10th, 2019 12:00AM Amkor Technology, Inc. 23K 5595 Open Semiconductors Apr 9th, 2019 10:07PM Apr 9th, 2019 10:07PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Apr 9th, 2019 12:00AM Amkor Technology, Inc. 23K 5593 Open Semiconductors Apr 8th, 2019 10:07PM Apr 8th, 2019 10:07PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Apr 8th, 2019 12:00AM Amkor Technology, Inc. 23K 5588 Open Semiconductors Apr 7th, 2019 10:07PM Apr 7th, 2019 10:07PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Apr 7th, 2019 12:00AM Amkor Technology, Inc. 23K 5593 Open Semiconductors Apr 6th, 2019 10:07PM Apr 6th, 2019 10:07PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Apr 6th, 2019 12:00AM Amkor Technology, Inc. 23K 5585 Open Semiconductors Apr 5th, 2019 10:08PM Apr 5th, 2019 10:08PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment

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