LinkedIn Profile

Access Amkor Technology historical Linkedin company profile data on number of followers, employee headcount and more

Records

Open dataset
Ticker Symbol Entity Name As Of Date Company Name Followers Employees on Linkedin Link Industry Date Added Date Updated Description Website Specialities Logo HQ.Street HQ.City HQ.State HQ.Country HQ.Postal GICS Sector GICS Industry
nasdaq:amkr 7135 Aug 23rd, 2019 12:00AM Amkor Technology, Inc. 26K 5802 Open Semiconductors Aug 22nd, 2019 10:06PM Aug 22nd, 2019 10:06PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Aug 22nd, 2019 12:00AM Amkor Technology, Inc. 26K 5801 Open Semiconductors Aug 22nd, 2019 12:24PM Aug 22nd, 2019 12:24PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Aug 21st, 2019 12:00AM Amkor Technology, Inc. 26K 5796 Open Semiconductors Aug 21st, 2019 11:49AM Aug 21st, 2019 11:49AM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Aug 20th, 2019 12:00AM Amkor Technology, Inc. 26K 5798 Open Semiconductors Aug 20th, 2019 01:02PM Aug 20th, 2019 01:02PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Aug 19th, 2019 12:00AM Amkor Technology, Inc. 26K 5797 Open Semiconductors Aug 18th, 2019 10:07PM Aug 18th, 2019 10:07PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Aug 18th, 2019 12:00AM Amkor Technology, Inc. 26K 5794 Open Semiconductors Aug 17th, 2019 10:07PM Aug 17th, 2019 10:07PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Aug 17th, 2019 12:00AM Amkor Technology, Inc. 26K 5794 Open Semiconductors Aug 16th, 2019 10:07PM Aug 16th, 2019 10:07PM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Aug 16th, 2019 12:00AM Amkor Technology, Inc. 26K 5792 Open Semiconductors Aug 16th, 2019 10:46AM Aug 16th, 2019 10:46AM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Aug 15th, 2019 12:00AM Amkor Technology, Inc. 26K 5792 Open Semiconductors Aug 15th, 2019 11:42AM Aug 15th, 2019 11:42AM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment
nasdaq:amkr 7135 Aug 14th, 2019 12:00AM Amkor Technology, Inc. 26K 5792 Open Semiconductors Aug 14th, 2019 11:35AM Aug 14th, 2019 11:35AM Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Open Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes Open 2045 East Innovation Circle Tempe Arizona US 85284 Technology Technology Hardware & Equipment

Request a demo to view additional historical data, and much more.

Make fast
queries

No longer rely on engineers to access data; build and share queries with intuitive tools, and derive insights in real time.

Bookmark queries with your team

Save and share custom queries using a private bookmarking feature, accessible to your whole team.

Be first to know with alerts

Scan data points across millions of companies and receive emails when relevant metrics cross critical thresholds.

Visualize data for quick insights

Create custom keyword-based word clouds, charts, and advanced visualizations to quickly analyze the data.

Map competitor locations

Analyze competitor presence and growth over time by overlaying store locations with the Nearby Competitor feature.