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private:statschippac
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15591
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Jun 3rd, 2019 12:00AM
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STATS ChipPAC Ltd.
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8.4K
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1935
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Open
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Semiconductors
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Jun 3rd, 2019 12:07PM
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Jun 3rd, 2019 12:07PM
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STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device.
STATS ChipPAC is wholly owned by Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). As the third largest OSAT in the world, the JCET Group of companies offer customers a comprehensive and broad product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), Through Silicon Via (TSV) and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea and customer support offices throughout Asia, the United States and Europe.
The JCET Group of companies includes Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP), also wholly owned by JCET. JCAP is the largest wafer bump and Wafer Level Chip Scale Packaging (WLCSP) provider in China with a broad set of capabilities including advanced wafer bump technology (copper pillar, gold and solder), wafer probe, WLCSP, Radio Frequency Identification (RFID), Encapsulated Chip Package (ECP) and Through Silicon Via (TSV) technology.
JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. For more information, visit www.jcetglobal.com.
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Open
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Semiconductor Packaging, Semiconductor Testing, Semiconductor Package Design, Semiconductor Wafer Bumping, IC Test, Wafer Bumping, Wafer Level Packaging, System-in-Package, Flip Chip, MEMS and Sensors, Integrated Passive Devices, Wirebond, eWLB, Package-on-Package, FOWLP, WLCSP
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Open
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10 Ang Mo Kio Street 65, #04-08/09 Techpoint
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Singapore
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SG
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569059
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STATS ChipPAC
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private:statschippac
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15591
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Mar 14th, 2018 12:00AM
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STATS ChipPAC Ltd.
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6.7K
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1799
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Open
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Semiconductors
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Mar 14th, 2018 07:25PM
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Mar 14th, 2018 07:25PM
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Open
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STATS ChipPAC
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private:statschippac
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15591
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Feb 17th, 2018 12:00AM
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STATS ChipPAC Ltd.
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6.3K
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1758
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Open
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Semiconductors
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Feb 17th, 2018 02:25PM
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Feb 17th, 2018 02:25PM
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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
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STATS ChipPAC
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private:statschippac
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15591
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Feb 16th, 2018 12:00AM
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STATS ChipPAC Ltd.
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6.3K
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1758
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Open
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Semiconductors
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Feb 16th, 2017 08:15AM
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Feb 16th, 2017 08:15AM
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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
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STATS ChipPAC
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private:statschippac
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15591
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Feb 15th, 2018 12:00AM
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STATS ChipPAC Ltd.
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6.3K
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1758
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Open
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Semiconductors
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Feb 15th, 2017 10:07AM
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Feb 15th, 2017 10:07AM
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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
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STATS ChipPAC
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private:statschippac
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15591
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Feb 14th, 2018 12:00AM
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STATS ChipPAC Ltd.
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6.3K
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1758
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Open
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Semiconductors
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Feb 14th, 2017 01:50PM
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Feb 14th, 2017 01:50PM
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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
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STATS ChipPAC
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private:statschippac
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15591
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Feb 13th, 2018 12:00AM
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STATS ChipPAC Ltd.
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6.3K
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1758
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Open
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Semiconductors
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Feb 13th, 2017 04:11PM
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Feb 13th, 2017 04:11PM
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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
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STATS ChipPAC
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private:statschippac
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15591
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Feb 12th, 2018 12:00AM
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STATS ChipPAC Ltd.
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6.3K
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1758
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Open
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Semiconductors
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Feb 12th, 2017 04:15AM
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Feb 12th, 2017 04:15AM
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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
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STATS ChipPAC
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private:statschippac
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15591
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Feb 11th, 2018 12:00AM
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STATS ChipPAC Ltd.
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6.3K
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1758
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Open
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Semiconductors
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Feb 11th, 2017 05:35AM
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Feb 11th, 2017 05:35AM
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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
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STATS ChipPAC
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private:statschippac
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15591
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Feb 10th, 2018 12:00AM
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STATS ChipPAC Ltd.
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6.3K
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1758
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Open
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Semiconductors
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Feb 10th, 2017 06:43AM
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Feb 10th, 2017 06:43AM
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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
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STATS ChipPAC
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