LinkedIn Profile

Access STATS ChipPAC historical Linkedin company profile data on number of followers, employee headcount and more
Ticker Symbol Entity Name As Of Date Company Name Followers Employees on Linkedin Link Industry Date Added Date Updated Description Website Specialities Logo HQ.Street HQ.City HQ.State HQ.Country HQ.Postal GICS Sector GICS Industry
private:statschippac 15591 Jun 3rd, 2019 12:00AM STATS ChipPAC Ltd. 8.4K 1935 Open Semiconductors Jun 3rd, 2019 12:07PM Jun 3rd, 2019 12:07PM STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device. STATS ChipPAC is wholly owned by Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). As the third largest OSAT in the world, the JCET Group of companies offer customers a comprehensive and broad product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), Through Silicon Via (TSV) and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea and customer support offices throughout Asia, the United States and Europe. The JCET Group of companies includes Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP), also wholly owned by JCET. JCAP is the largest wafer bump and Wafer Level Chip Scale Packaging (WLCSP) provider in China with a broad set of capabilities including advanced wafer bump technology (copper pillar, gold and solder), wafer probe, WLCSP, Radio Frequency Identification (RFID), Encapsulated Chip Package (ECP) and Through Silicon Via (TSV) technology. JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. For more information, visit www.jcetglobal.com. Open Semiconductor Packaging, Semiconductor Testing, Semiconductor Package Design, Semiconductor Wafer Bumping, IC Test, Wafer Bumping, Wafer Level Packaging, System-in-Package, Flip Chip, MEMS and Sensors, Integrated Passive Devices, Wirebond, eWLB, Package-on-Package, FOWLP, WLCSP Open 10 Ang Mo Kio Street 65, #04-08/09 Techpoint Singapore SG 569059
private:statschippac 15591 Mar 14th, 2018 12:00AM STATS ChipPAC Ltd. 6.7K 1799 Open Semiconductors Mar 14th, 2018 07:25PM Mar 14th, 2018 07:25PM Open
private:statschippac 15591 Feb 17th, 2018 12:00AM STATS ChipPAC Ltd. 6.3K 1758 Open Semiconductors Feb 17th, 2018 02:25PM Feb 17th, 2018 02:25PM STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
private:statschippac 15591 Feb 16th, 2018 12:00AM STATS ChipPAC Ltd. 6.3K 1758 Open Semiconductors Feb 16th, 2017 08:15AM Feb 16th, 2017 08:15AM STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
private:statschippac 15591 Feb 15th, 2018 12:00AM STATS ChipPAC Ltd. 6.3K 1758 Open Semiconductors Feb 15th, 2017 10:07AM Feb 15th, 2017 10:07AM STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
private:statschippac 15591 Feb 14th, 2018 12:00AM STATS ChipPAC Ltd. 6.3K 1758 Open Semiconductors Feb 14th, 2017 01:50PM Feb 14th, 2017 01:50PM STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
private:statschippac 15591 Feb 13th, 2018 12:00AM STATS ChipPAC Ltd. 6.3K 1758 Open Semiconductors Feb 13th, 2017 04:11PM Feb 13th, 2017 04:11PM STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
private:statschippac 15591 Feb 12th, 2018 12:00AM STATS ChipPAC Ltd. 6.3K 1758 Open Semiconductors Feb 12th, 2017 04:15AM Feb 12th, 2017 04:15AM STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
private:statschippac 15591 Feb 11th, 2018 12:00AM STATS ChipPAC Ltd. 6.3K 1758 Open Semiconductors Feb 11th, 2017 05:35AM Feb 11th, 2017 05:35AM STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
private:statschippac 15591 Feb 10th, 2018 12:00AM STATS ChipPAC Ltd. 6.3K 1758 Open Semiconductors Feb 10th, 2017 06:43AM Feb 10th, 2017 06:43AM STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.

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